ArchGen Labs发布3D芯片设计工具
摘要
ArchGen Labs（YC F26）推出面向3D芯片的AI设计工具：LayerTherm预测芯片温度图约比传统EDA快5000倍，布局引擎在Hudson River Trading宏布局挑战赛全球第一，另有自主设计工程师Newton，目标2027年中首次流片。
原文片段
ArchGen Labs | Building skyscrapers for semiconductor chips AI-powered chip design tools for the next generation of 3D semiconductors. \*\*TLDR; We’re building the tools to out more transistors on a chip. Our foundational models run roughly 5,000× faster than current EDA software and our core place…